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　　5AC600.FLAP-K01 Other names:

　　Analog unit 5AC600.FLAP-K01

　　5AC600.FLAP-K01 Editable controller

　　Input and output unit 5AC600.FLAP-K01

　　Compact design and space optimization

　　Size: With a thin body of 275mm×210mm×88.5mm, the volume is reduced by about 40% compared with traditional industrial computers, suitable for embedded installation or dense deployment in cabinets.

　　Modular layout:

　　Double-layer stacking design: The motherboard and I/O interface board are stacked vertically to shorten the internal wiring distance and reduce signal interference.

　　Scalable storage: supports dual storage modes of mSATA solid state drive + 2.5-inch mechanical hard drive, taking into account both speed and capacity.

　　Cableless interface: adopts onboard RJ45 and USB3.0 interfaces to reduce external cable connections and simplify wiring.

　　Heat dissipation and energy efficiency

　　Fanless heat dissipation:

　　Heat pipe conduction: built-in 3 pure copper heat pipes, directly contact the CPU/GPU chip, and quickly conduct heat to the heat dissipation fins.

　　Metal shell auxiliary heat dissipation: the aluminum alloy shell has both electromagnetic shielding and heat dissipation functions, and the surface temperature can be reduced by 15-20℃.

　　Low-power components:

　　Equipped with Intel low-power U series processors (such as Core i5-8365U), TDP is only 15W, and supports automatic frequency reduction in energy-saving mode.

　　Industrial-grade power module conversion efficiency ≥90%, standby power consumption is less than 10W.

　　Installation and scalability

　　Flexible installation method:

　　Rail installation: supports 35mm standard DIN rail, suitable for deployment in electrical cabinets.

　　Wall mounting: Provides VESA 75mm×75mm wall mounting holes, which can be fixed on the wall or equipment bracket.

　　Expansion capability:

　　Rich interfaces: Provides 4×USB3.0, 2×RS232/485 serial ports, 2×Gigabit Ethernet ports, and supports WiFi/Bluetooth expansion modules.

　　PCIe expansion: Reserves full-height PCIe×4 slots, which can be connected to external frame grabber cards or motion control cards.

　　Typical application scenarios

　　Intelligent equipment control: such as the main control unit of small CNC machine tools and 3D printers, integrating motion control and data acquisition functions.

　　Edge computing node: As a local data processing center in the logistics sorting system, it analyzes sensor data in real time and sends control instructions.

　　Vehicle/shipborne equipment: Through wide temperature design (-40℃ to 70℃) and seismic-resistant structure, it adapts to the complex environment of mobile carriers.

　　Industrial automation control

　　As the host computer of the PLC control system, it realizes production line status monitoring, process parameter adjustment and fault warning.

　　Case: Robot control in automobile welding workshop, data collection of food and beverage filling line.

　　Edge computing node

　　Take on local data processing and cloud communication tasks in the industrial Internet of Things architecture to reduce network latency.

　　Case: Oil pipeline pressure monitoring, smart grid equipment status analysis.

　　Smart device integration

　　Integrate sensors and actuators to achieve equipment status monitoring and predictive maintenance.

　　Case: Visual inspection system integration in 3C electronic manufacturing.

　　All products on this website are special products, and the market price has been fluctuating.

　　Specifically subject to customer service quotation, because the product is a new product, the price is not real,

　　Please confirm the model and product, price and other detailed information with customer service before placing an order. The website has been used.

　　New ones are on sale, please contact customer service for communication.

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