100-1551-54 | APS | 100-1551-54 | Gate Digital Integrated Circuit Board
The APS high-speed optocoupler 100-1551-54 supports a data rate of 50Mbps, has an insulation voltage of 3750Vrms, an output type of Totem Pole, an operating temperature range of -40°C to +105°C, and a power consumption of 40mW. Its logic gates, such as the LS TTL series, have an output source current of -400µA (logic 1), a sink current of 8mA (logic 0), and a noise margin of approximately 0.4V. It is widely used in automotive electronics, industrial control, communication equipment, and consumer electronics. Industry trends include accelerated domestic substitution, higher speeds and lower power consumption, integration and modularization, and the high reliability requirements of automotive electronics.
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Other names for 100-1551-54:
Analog Module 100-1551-54
100-1551-54 Interface Board
Digital Module 100-1551-54
Panasonic
APS Series Optocouplers (e.g., APS 100-1551-54):
Core Performance: The APS high-speed optocoupler 100-1551-54 supports a data rate of 50Mbps, insulation voltage of 3750Vrms, output type Totem Pole, operating temperature -40°C to +105°C, power consumption of 40mW; logic gate circuits are like the LS TTL series, output source current -400µA (logic 1), sink current 8mA (logic 0), noise margin approximately 0.4V.
MN41C/MN42C Series: CMOS logic gate circuits (such as MN41C41002SJ), providing multi-channel logic gates (AND gates, OR gates, NOT gates, etc.), suitable for digital signal processing and interface circuits.
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Electrical Characteristics: Input/output voltage matching (e.g., TTL logic 1 ≥ 2.0V, logic 0 ≤ 0.8V), fan-out capability (single output driving multiple inputs), and dynamic parameters (propagation delay, rise/fall time).
Packaging and Interfaces: Common DIP, SOIC, QFN packages, supporting GPIO and JTAG debugging interfaces, some integrating ADC/DAC and power management modules.
Toshiba
TB9084FTG: 3-phase brushless DC motor gate driver IC, compliant with AEC-Q100 Grade 0 automotive standard, supporting applications such as electric seats, electric tailgates, and hybrid vehicle power boosters.
TXZ+™ Series Microcontrollers: Integrating digital logic, analog front-end, and power management functions, suitable for automotive electronics, industrial control, and other fields.
Broadcom
BCM56873A0KFSBG: 48-port 10/25GbE + 8-port 100GbE Ethernet switch chip, supporting high-speed network communication and data center applications.
BCM88470C series: 300Gbps Ethernet switches, suitable for high-performance network equipment.
Nexperia
Logic IC series: Includes buffers/drivers, counters, flip-flops, logic gates, etc., supporting automotive-grade certification (AEC-Q100), suitable for automotive electronics, industrial automation, and other scenarios.
ROHM
Gate driver ICs: Such as IGBT/MOSFET gate drivers, supporting high-voltage, high-current applications, suitable for motor drives, power management, and other scenarios.
Technical parameters and characteristics
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Logic gate current characteristics
LS TTL gates: Source current -400µA, sink current 8mA; noise margin ensures logic level compatibility.
CMOS logic gates: Low-power design, wide input/output voltage range, suitable for low-power devices.
Power and Signal Isolation
Optical Couplers: Provide electrical isolation and immunity to electromagnetic interference, suitable for high-voltage and high-noise environments.
Digital Isolators: Support high-speed data transmission, such as Broadcom's digital isolators.
Packaging and Interfaces
DIP, SOIC, QFN, and other package types to suit different application scenarios (e.g., breadboard experiments, PCB integration).
Compatibility Design: Ensures level compatibility between different logic families (e.g., TTL, CMOS).
Application Scenarios
Industrial and Automotive: Motor control (e.g., Toshiba TB9084FTG driving three-phase brushless DC motors, compliant with AEC-Q100 Grade 0 standards), power management, smart grids, electric vehicle charging stations.
Communications and Consumer Electronics: 5G base station signal isolation, IoT devices (e.g., sensor nodes), smart homes (automatic door control boards), wearable devices.
Emerging Fields: Renewable energy (solar inverters), medical devices (image processing), aerospace (satellite communication modules).
Troubleshooting
Common Issues: Floating inputs causing unexpected outputs (requires external pull-up/pull-down resistors); power supply noise causing false triggering (add filter capacitors); signal delay causing timing errors (optimize wiring length).
Debugging Tools: Oscilloscope to measure signal waveforms; logic analyzer to capture bus data; multimeter to check power supply voltage and grounding.
Solutions: Replace the faulty IC (e.g., for NRND models, find a replacement part); repair cold solder joints; update firmware to fix logic errors.
Industry Trends and Challenges
Accelerated Domestic Substitution
Domestic analog chip manufacturers (such as CR Microelectronics and Silan Microelectronics) are accelerating domestic substitution in logic gate circuits and power management chips, balancing performance, cost, and supply chain risks.

High Speed and Low Power Consumption
5G, IoT, and AI technologies are driving the development of digital integrated circuits towards higher speeds and lower power consumption.
For example, Broadcom's BCM56873A0KFSBG supports a 100GbE high-speed interface, suitable for data centers and high-performance computing scenarios.
Integration and Modularization
Integrating more functions (such as logic gates, drivers, and power management) into a single chip reduces PCB area and improves system reliability.
For example, Toshiba's TXZ+™ series microcontrollers integrate digital logic, analog front-end, and power management functions.
Automotive Electronics Reliability Requirements
Automotive-grade chips must pass stringent certifications such as AEC-Q100 to ensure long-term reliability in harsh environments such as high temperature, high humidity, and high vibration.
Summary: APS 100-1551-54 Gate Digital Integrated Circuit Boards are widely used in automotive electronics, industrial control, communication equipment, and consumer electronics. Industry trends include accelerated domestic substitution, high speed and low power consumption, integration and modularization, and the high reliability requirements of automotive electronics. Further analysis of specific models or application scenarios is available for in-depth discussion.
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